QLD5516, Single Component epoxy bonding Adhesive, Heating Cured Single Component epoxy Adhesive
Brand: Generic
$N/ABuy It Now
| Brand | Generic |
| Rating | N/A (0 ratings) |
| Price | $N/A |
| Category | Accessories |
Description
QLD5516, Single component epoxy bonding adhesive is a heat-curing one-component epoxy encapsulant. It has the characteristics of stable storage, moderate viscosity, good insulation performance, high bonding performance, and easy to use compared with two-component. It is suitable for bonding and sealing of metals, coils, motors and other components. Heating cured single component epoxy adhesive, light, Mainly used for bonding and sealing electronic components such as IC chips and circuit boards
Features
- Take the glue out of the refrigerator and put it at room temperature to balance with the outside world for 1~2 hours.
- Glue dotted on the substrate, if the viscosity of the glue is high, the glue can be preheated at 40~50 °C beforeluing, or it can be used without preheating.
- Heating and curing.
- After use, the lid should be covered in time and stored in the refrigerator at 5°C.